TAB – Tape Bonding
From: Author:Jim Lee Publish time:2023-09-08 10:31 Clicks:3
▲ DST （Double Adhesive Type）
The mounting is done such that the bonding sites of the die, usually in the form of bumps or balls made of gold or solder, are connected to fine conductors on the tape, which provide the means of connecting the die to the package or directly to external circuits. Sometimes the tape on which the die is bonded already contains the actual application circuit of the die.